Laying out the "Ground" in a Mixed Analog/Digital
Circuit Board Design
by Prof. Todd Hubing (Clemson University)
Problematic printed circuit board layouts are often the result of somebody trying to comply with EMC design rules related to the routing of "ground" in mixed analog/digital boards. It is important to remember that the planes and traces in a circuit board that are labeled "ground" often serve two purposes. Ground planes are designed to provide a zero potential reference for the signals on the board; and they are part of the signal current path. Unfortunately, the accepted rules for laying out ground conductors and signal current conducts often conflict with one another. This presentation reviews grounding concepts that are particularly important when designing a mixed-signal circuit board. It also discusses methods for meeting all signal path requirements while ensuring that the ground structure provides a stable and quiet, zero-potential reference.
Chip-Package-Board Co-design applying
IC Power-pin Model
by Takashi Harada, Ph.D. (NEC Lab.)
As the signal processing speed of
semiconductor chips gets faster and package technology
progresses, noise margin decreases making packaging
design more difficult. Such difficulties often require
re-design of board and package layouts. In order to
reduce the time lost by reiteration and to improve
design efficiency, a quick estimation methodology for
analyzing signal/power integrity of chip-package-board
co-design is needed. This presentation will introduce a
power supply voltage fluctuation analysis methodology
for a high-speed PCB that will help you realize
effective chip-package-board co-design. This methodology
will contribute to significantly improving design flow
at the early development stage.
Introduction of EMIStream and
PIStream & EMIStream User Testimonial
by Eriko Yamato (Tech Dream, Inc)
Thursday August 21, 2008
from 3:30 PM- 6:30 PM at
The Detroit Marriott
at the Renaissance Center, Cadillac
More Info About Seminar, Contact:
Risa Barkenhagen
NEC Corporation of America
(858) 467 4792
risa.barkenhagen@necam.com
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