- Noise Control for Real-World PCB Design -
Date: Aug 21,
2008
Time: 15:30 – 18:30
Venue: Marriott Hotel Detroit
<Speakers>
Prof. Todd Hubing (Clemson University)
Laying out the "Ground" in a Mixed Analog/Digital Circuit
Board Design
PhD. Takashi Harada (NEC Lab.)
Chip-Package-Board Co-design applying LSI Power-pin Model
Eriko Yamato (TechDream, Inc)
Introduction of EMIStream and PIStream
EMIStream User
Testimonial - Success story by SI/EMC Engineer
Abstract:
Laying out the "Ground" in a Mixed
Analog/Digital Circuit Board Design
Prof. Todd Hubing
 Problematic printed circuit board
layouts are often the result of somebody trying to comply
with EMC design rules related to the routing of "ground"
in mixed analog/digital boards. It is important to
remember that the planes and traces in a
circuit board that are labeled "ground" often serve two
purposes.
Ground planes are designed to provide a zero potential
reference for the signals on the board; and they are part
of the signal current path.
Unfortunately, the accepted rules for laying out ground
conductors and signal current conducts often conflict with
one another.
This presentation reviews grounding concepts that are
particularly important
when designing a mixed-signal circuit board.
It also discusses methods for meeting all signal path
requirements while ensuring that the ground structure
provides a stable and quiet, zero-potential reference.
Chip-Package-Board Co-design applying LSI Power-pin Model
PhD. Takashi Harada
 A fast board-power-voltage fluctuation analysis system to realize the chip-package-board co-design is presented.
To reduce the time loss by the rework
and increase circuit design efficiency, short
turnaround-time estimation techniques for analyzing the
signal integrity and the power integrity of integrating
chip-package-board characteristics have been required.
This system contributes to the increase
of design efficiency in the early product development
stage.
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